Live Virtual Exposition: October 13-14, 2020
On-Demand Conference & Expo: October 13-30, 2020

About the International Wafer-Level Packaging Conference

IWLPC is now in its 17th successful year as a well-established international conference, boasting annual representation from over 19 countries. The technical program and exhibition focus on semiconductor packaging and advanced wafer-level packaging technology featuring 3 tracks in WLP, 3D Integration, and Advanced Manufacturing and Test. This year is a continuation of Bridging the Boundaries: Wafer, Panel and Beyond reflecting the enablement of 5G communications, AI, and IoT, automotive and more.

Frequently Asked Questions

A “Live Day” is when the virtual conference and exhibition is supports live chat (text or video), presentation streaming, and other features. All live sessions and exhibitor chat will take place between October 13th – October 14th. If you are unable to attend during the live event days, you will still have access to the expo, download exhibitor handouts, and stream on-demand presentations through October 30th.
No, you don’t need to download anything. You will only need access to the internet.
Exhibitors can link live demos in their booths by using third-party software such as zoom, Microsoft teams, etc. to attendees/customers.
Yes, we have a feature called the “Briefcase” or “Swag Bag.” You can add items to this at any time!
Chatting with exhibitors will be available 24 hours a day for the first 2 days of the event. Some booths may choose to have specific chat hours, you can locate this information inside the exhibitor booths.
On-demand presentations are available for streaming October 13th – October 30th, 2020.
You can find live sessions by clicking in the Auditorium and selecting the “Live Sessions” tab.
Send an email to for any technical assistance.